Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applicationsWhat is BS EN IEC 6119013 Attachment materials for an electronic assembly about? BS EN IEC 6119013 is a quality control standard that discusses attachment materials for electronic assembly. BS EN IEC 6119013 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non fluxed bar, ribbon, powder solders, and solder paste, for electronic soldering applications, and for "special" electronic grade solders. Note: BS

The method of measurement and the measuring set-up shall be in accordance with CISPR 16-2-2

Electrostatic coating: 10 μm to 200 μm

It does not apply to films to which lacquers have been applied

transportable or personal

this British Standard will help organizations develop a framework for managing OH&S so employees and others

NOTE If a term has one or more permitted synonyms

heat pump systems

This Subsection includes a proforma for a certificate of test and examination which covers

– converter transformers for HVDC applications (IEC 61378‑2)

Acoustic performance

Designed concrete

2 Sludge quantity assessment