Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) solderingBS EN 61760 3: 2010 Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering BS EN 61760 3 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of BS EN 61760 3 is to ensure that components with leads

or national policy considerations

BS ISO/IEC 20000-2 represents an industry consensus on guidance to auditors

What is BS 5131-1

1 Vapour phase reflow soldering

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BS EN 13427:2004 provides a framework within which this and four other standards (BS EN 13429

6 Practical experiences in implementation

Table 101 – Values of assumed loading

No limitation is placed on temperature

7 Product realization

It is increasingly common for lone workers to be equipped with electronic devices that enable them to transmit their location and request assistance when they feel threatened

In its simplest form a passive sampling device is comprised solely of a membrane